HESSE MECHATRONICS BJ855
The Hesse Mechatronics BJ855 is a fully automatic equipment that has the function of making electrical connections between the chip and the substrate by means of a gold or aluminum wire or ribbon.
Specifications
| Parameter | Value |
Mode | Automatic option
|
work area (x, y, z) | 305 x 410 x 31 mm |
Heating worktable | |
Number | 2 |
Types of material that can be handled | Substrates of different sizes/heights |
Work area temperature | Up to 200°C
|
Soldering head DA06 (wedge-wedge) | |
Wire | Fine, deep access (90°) |
Round wire Au, AI | 17.4 µm - 50 µm |
Ribbon Au, AI | 6 × 35 µm – 25 × 250 µm |
Tool length | 25.4 mm |
Head rotation | 440° |
Speed | Approx. 4 threads/s (varies with conditions) |
Coils | 2" |
Soldering head BW01 (ball-wedge) | |
Wire | Fine |
Round wire Au |
|
Capillairies | 19 mm et 11.1 mm |
Head rotation | 180° |
Transducer frequencies | 120 kHz and 60 kHz |
Speed | About 2-3 threads/s (varies with conditions) |
Coils | 2" |
Ebox Option included