Assembly, encapsulation and prototyping
3D PCB printing
Chip-Level Assembly
- 3D manual assembly system - TRESKY T-3002-FC3
- Manual tehrmocompression assembly system - FINEPLACER PICO TB
- Fine wire bonding system (Al wedge bonding) - KULICKE&SOFFA 484
- Fine wire bonding system (Al/Au/Cu, wedge/ball/bump/ribbon bonding) - TPT HB10
- Large wire bonding system (Al/Cu, wedge/ribbon bonding) - TPT HB30
- UV lamp - DYMAX BlueWave 200
- Automatic wire bonding system - HESSE MECHATRONICS BJ855
- Wire bond characterization system (pull/shear) - NORDSON DAGE 4000Plus
PCB-level assembly
- Automated non-contact fluid dispensing system - NORDSON S-820
- Automatic screen printing - DEK ASM-E
- Manual screen printing - LPKF ProtoPrint S
- Automatic pick and place - MYCRONIC MY200LX
- Eight zone reflow oven - HELLER 1826 MK5
- Prototyping convection oven - LPKF PROTOFLOW S
- Ultrasonic bath - BRANSONIC CPX1800H
- Ultrasonic bath - BRANSONIC CPX8800H
- Drying oven - DESPATCH INDUSTRIES LAC218
- Drying oven - THERMO FISHER HERATHERM OMH100
- Automatic PCB cleaning system - AAT Aqua ROSE 4.0 CL