LPKF PROTOFLOW S
Convection oven for reflow during assembly of prototype SMT components having the following characteristics:
- Certified lead free
- Computer-adjustable temperature profiles
- Two-sided welding allowed
- Welding with Nitrogen environment possible
Specifications
Parameter | Value | Note |
---|---|---|
Max. PCB width | 230 mm x 305 mm (9 x 12) | Maximum height including pcb is 30.0 mm (1.18) |
Space required at the edge of PCB | Top : 0.0 mm (0.0)
Bottom : 2.4 mm (0.079) | Space required for PCB support bars. |
Max. Temperature preheating | 220 °C | 999 s |
Max. Reflow temperature | 320 °C | 600 s |
Max. heat treatment | 220 °C | 64h (long term) |
Max. power | 3200 watts (Printing) |
|
Temperature stabilization time | < 5 min |
|