NORDSON S-820
Automated system of non-contact glue deposition and deposit of solder paste.
Two different deposit heads are available: Jett printer and valve auger.
Specifications
| Parameter | Value |
|---|---|
| Jett printer DJ-9500 | |
Diameter of the drop | < 400 µm (According to the chosen accessory) |
Volume | < 3 nl |
Deposit speed | 200 drop per second |
| Valve Auger DV-800 | |
Solder paste type | Type 3, 4, 5, and 6 |
Diameter of the drop | < 0.5 mm (According to the chosen needle) |
Jett Printer Applications
- Underfill
- BGA Solder Ball Reinforcement
- Chip Scale Packaging
- Cavity fill
- Die attach
- Lid Seal
- Chip Encapsulation
- No Flow Underfill
- Conductive Adhesive
- Medical Device Assembly
Valve Auger Applications
- Dams
- Die Attach
- Lid Sealants
- Thermal Grease
- Solder paste dispensing