TPT HB10
Semi-automatic micro-wiring (wire bonding) system for electrical connections between the chip and the substrate through a thin wire or a gold, aluminum or copper ribbon.
Specifications
| Parameter | Value | Note |
|---|---|---|
Work table | 21 cm x 26cm | |
Heated work stand | Support #1 : 100 mm x 100 mm Support #2: 90 mm diameter
| Temperature up to 250°C Adjustable height Maintenance of samples mechanically or by suction |
Z-displacement of the head | 17 mm | 1 µm increment |
Type of weld | Wedge bonding Round wire Au, Al, Cu: 17.5 to 75 μm
Ball/Bump bonding Round wire Au, Cu: 15 to 50 μm
Ribbon bonding Ruban Au, Al, Cu : max. 25 μm x 250 μm
| |
Coils | 2" |
|
Transducer frequency | 63.3 kHz |
|
Ultrasonic power | 0-10 watts |
|
Programmable welding time | 0 to 10 sec. |
|
Programmable welding force | 15 g to 150 g |
|
Number of programs that can be recorded | 100 |
|