AML Wafer Bonder

Description

Assembly of substrates or samples by direct, anodic, eutectic or polymeric bonding

Manufacturer and model

Applied Microengineering Ltd - AWB-04

Technical specifications

• Small samples and 100mm substrates
• Clamping of samples of 1cm x 1cm, 75mm and 100mm
• Visible and IR alignment for substrates of 75mm and 100mm
• Assembly under atmosphere and vacuum (~ 0.1mTorr)
• Independent heating of platen up to 500°C
• Anodic bonding up to 2.5kV limited current
• Activation by O₂ plasma
• Minimum assembly force of 150N
• Maximum assembly force of 25kN
• Water vapor injection

Examples of available processes

• Direct Si / Si bonding with plasma activation
• Anodic bonding of Pyrex substrates