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Serge Ecoffey

Professeur sous octroi de recherche, Faculté de génie
FAC. GÉNIE Électrique et informatique

Présentation

Sujet de recherche

Micro and Nanoelectronics, Nanomaterials

Disciplines de recherche

Electrical Engineering and Electronic Engineering, Material Engineering and Metallurgic Engineering

Mots-clés

Microelectronic devices and systems, MEMS, Advanced packaging, Nanofabrication, Chemical mechanical planarization, Micromachining, Process integration, 3D integration

Langues parlées et écrites

Anglais, Français, Allemand, Italien, Espagnol (castillan)

Diplômes

(2012). Fabrication of non-volatile memory based on hybrid SET-CMOS technology (Post-doctorate, Post-doctorate). Université de Sherbrooke.

(2007). Ultra-Thin Nanograin Polysilicon Devices for Hybrid CMOS-NANO Integrated Circuits (Doctorate, Docteur ès Sciences). Swiss Federal Institute of Technology Lausanne.

(2001). Procédés technologiques pour la réalisation de films ultraminces à nanocristaux de Si: application à une mémoire à quelques électrons (Master's Thesis, Ingénieur en science des matériaux). Swiss Federal Institute of Technology Lausanne.

Expérience académique

Associate Professor. (2022-2027). Université de Sherbrooke. Canada.

Co-director 3IT.nano Nanofabrication platform. (2024-2025). Université de Sherbrooke. Canada.

Adjunct Professor and research associate. (2012-2022). Université de Sherbrooke. Canada.

Research associate and adjunct professor. (2012-2022). Université de Sherbrooke. Canada.

Postdoc. (2009-2012). Université de Sherbrooke. Canada.

Research Engineer. (2001-2007). Swiss Federal Institute of Technology Lausanne. Switzerland.

Prix et distinctions

  • Rising Stars Dawant R*. CMC Microsystems. (Prize / Award).
  • Rising Stars Najah M*. CMC Microsystems. (Prize / Award).
  • Young Researcher Prize Labalette M*. IEEE NMDC Conference. (Prize / Award).

Financement

  • Grant. (Awarded). Co-applicant. LASERS: Leveraging Advanced Substrate Epitaxy for Reusable Optoelectronics Substrates. Natural Sciences and Engineering Research Council of Canada (NSERC). Umicore. Alliance Advantage. 770 000 $. (2024-2029)
  • Grant. (Under Review). Principal Applicant. Integration of a Bio-sourced epoxy for the reduction of BPA and petro-chemical agents in the microelectronics packaging eco-system. Natural Sciences and Engineering Research Council of Canada (NSERC). Alliance Option 2. 2 170 150 $. (2024-2029)
  • Grant. (Awarded). Principal Applicant. Microelectromechanical systems heterogeneous integration and cryogenic packaging at the wafer scale. Natural Sciences and Engineering Research Council of Canada (NSERC). Discovery Grant. 195 000 $. (2024-2029)
  • Grant. (Awarded). Co-applicant. RQMP - Regroupement Québécois sur les Matériaux de Pointe. Fonds Québécois de la Recherche sur la Nature et les Technologies (FQRNT). Regroupement stratégique. 3 000 000 $. (2022-2028)
  • Grant. (Awarded). Principal Applicant. Développement d'un procédé manufacturable pour la fabrication de guides d'ondes dans les isolateurs - Faraday Rotator. Natural Sciences and Engineering Research Council of Canada (NSERC). AEPONYX. Matériaux avancés. 276 298 $. (2024-2027)
  • Grant. (Awarded). Co-applicant. LUCIUS: Laser et phototransducteurs pour le transfert de puissance. PROMPT-Québec. Laser Components Canada Inc. Aliance. 408 000 $. (2024-2027)
  • Research Chair. (Awarded). Principal Applicant. C2MI research chair in microfabrication and integration. University of Sherbrooke. C2MI - MiQro Innovation Collaborative Center. UdeS support to research chair. 107 700 $. (2022-2027)
  • Grant. (Awarded). Co-applicant. De la convergence des transitions socioécologique et numérique : une démarche de recherche-intervention pour soutenir l’innovation responsable dans le contexte de la zone d’innovation Technum/Bromont. Fonds de recherche du Québec - Nature et technologies (FRQNT). STIMuleS. 756 933 $. (2023-2026)
  • Research Chair. (Awarded). Collaborator. Chaire de recherche en technologies d’assemblages microélectroniques pour l’énergie et l’optoélectronique. Fonds de recherche du Québec - Nature et technologies (FRQNT). C2MI - Centre de collaboration MiQro Innovation. C3P Gazelle. 373 464 $. (2023-2026)
  • Research Chair. (Awarded). Co-applicant. Procédés de microfabrication avancés pour le développement de dispositifs photoniques intégrés de nouvelle génération. Fonds de recherche du Québec - Nature et technologies (FRQNT). Teledyne Dalsa. C3P Gazelle. 45 000 $. (2023-2026)
  • Grant. (Awarded). Collaborator. A versatile multi-project cleanroom fabrication process for superconducting quantum circuits. Natural Sciences and Engineering Research Council of Canada (NSERC). Angstrom Engineering. Alliance Grants. 30 000 $. (2023-2026)
  • Grant. (Awarded). Co-applicant. CMOS-OxRAM integrated circuits for low-power AI and cryogenic quantum dot auto-tuning. Natural Sciences and Engineering Research Council of Canada (NSERC). Alliance Grants - Quantum - Strengthening Capacity. 658 000 $. (2023-2026)
  • Grant. (Awarded). Principal Investigator. Chemical mechanical planarization a technology enabler for devices, circuits and microsystems innovation. Natural Sciences and Engineering Research Council of Canada (NSERC). Research Tools and Instruments. 82 544 $. (2024-2025)
  • Grant. (Awarded). Co-applicant. Development of novel quantum vacuum-based electronic devices platform and enabling its microfabrication methods. Natural Sciences and Engineering Research Council of Canada (NSERC). IPL - Infinite Potential Labs. Alliance. 256 500 $. (2022-2025)
  • Grant. (Awarded). Collaborator. Multi-user and low-cost silicon interposer platform for bio/quantum systems. Natural Sciences and Engineering Research Council of Canada (NSERC). Xanadu. Alliance. (2022-2025)
  • Research Chair. (Awarded). Collaborator. NSERC/Teledyne DALSA Industrial Research Chair in Next Generation MEMS and Microphotonics. PROMPT-Québec. Teledyne Dalsa. Industrial research Chair. 700 000 $. (2020-2024)
  • Grant. (Awarded). Principal Applicant. Développement d'une librairie de structures de contrôle de procédés. Mathematics of Information Technology and Complex Systems (MITACS). C2MI - MiQro Innovation Collaborative Center. 37 500 $. (2023-2024)
  • Grant. (Awarded). Co-applicant. Commutateurs RF compacts microfabriqués pour les mesures cryogéniques. Canada First Research Excellence Fund. Concours 2022 – Appel à projets de recherche de l’Institut Quantique. 39 900 $. (2022-2024)
  • Grant. (Awarded). Collaborator. Hardware implementation of spiking neural networks based on hybrid CMOS-memristors circuits for ultralow-power artificial intelligence at the edge. Fonds de recherche du Québec - Nature et technologies (FRQNT). Projets de recherche en équipe. 229 620 $. (2021-2024)
  • Grant. (Completed). Co-applicant. UNICO - Unsupervised spiking neural networks with analog memristive devices for edge computing. Swiss National Science Foundation (SNSF). Narodowe Centrum Nauki (Poland). CHISTERA. 172 282 $. (2020-2023)
  • Grant. (Completed). Collaborator. Porous germanium Efficient Epitaxial LayEr Release (PEELER) for low cost high performance III-V solar cells. Ministère du développement économique, de l'innovation et de l'exportation (MDEIE). Saint-Augustin Canada Electric Inc.. InnovEE. 750 000 $. (2019-2023)
  • Grant. (Completed). Co-applicant. Heterogeneous Integration of High-Density Analog Crossbar for Advanced Data Processing. Natural Sciences and Engineering Research Council of Canada (NSERC). Strategic Partnership Grants. 577 000 $. (2017-2021)
  • Grant. (Completed). Co-applicant. STREAMS Plus – Technologies pour les Systèmes inTelligents pour la gestion theRmique haute EfficAcité de la Microélectronique avancée. Mathematics of Information Technology and Complex Systems (MITACS). MiQro Innovation Collaborative Centre. MITACS Accélération. 176 000 $. (2020-2020)
  • Grant. (Completed). Co-applicant. Complementary resistance switching in nano crossbar arrays. Fonds Québécois de la Recherche sur la Nature et les Technologies (FQRNT). Projet de recherche en équipe. 123 000 $. (2013-2016)
  • Grant. (Completed). Co-applicant. 3D heterogeneous platform with highly sensitive integrated gas sensors based on ultra-low power metal SETs circuits. NanoQuébec. Plasmionique (Industrial partner). INano. 106 666 $. (2013-2015)
  • Grant. (Completed). Co-applicant. High energy electron beam lithography for ultimate resolution. Unité Mixte Internationale UMI 3463. 100 000 $. (2012-2013)
  • Grant. (Completed). Collaborator. Single Electron Devices on CMOS technology. Natural Sciences and Engineering Research Council of Canada (NSERC). Strategic (with ANR France). 617 000 $. (2009-2012)

Publications

Articles de revue

  • Gherman, R*; Beaudin, G; Stricher, R*; Bryche, J F; Drouin, D; Charette, P G; Ecoffey, S. (2024). Abrasive-free chemical-mechanical planarization (CMP) of gold for thin film nano-patterning. Nanoscale (Submitted).
  • Coffineau, D; Gariepy, N; Dawant, R*; Ecoffey, S; Alibart, F; Jaouad A; Grondin E; Beilliard, Y; Ruediger, A; Drouin, D. (2024). CMOS-compatible Hf0.5Zr0.5O2-based ferroelectric memory crosspoints fabricated with damascene process. Nanotechnology (Accepted).
  • ElShaer, A*; Ecoffey, S; Jaouad, A; Monfray, S; Drouin, D. (2024). CMOS compatible Hydrogen sensor using Platinum gate and ALD-Aluminum oxide. MDPI Sensors 24 (Published).
  • Dawant, R*; Gaudreau, M*; Roy, M A*; Mouny, P A; Valdenaire, M*; Gliech, P*; Arias-Zapata, J; Alibart, F; Drouin, D; Ecoffey, S. (2024). Damascene Versus Subtractive Line CMP Process for Resistive Memory Crossbars BEOL Integration. Micro and Nano Engineering 100251 (Published).
  • Mouny, P A; Dawant, R*; Dufour, P; Valdenaire, M*; Ecoffey, S; Pioro-Ladriere, M; Beillard, Y; Drouin, D. (2024). Towards scalable cryogenic quantum dot biasingusing memristor-based DC sources. Cryogenics (Submitted).
  • Dufour, P; Lemay, J; Garg, N; Drolet, P; Mouny, P A; Pandey, S; Melot, A; Zain, M; Balafrej, I; Ecoffey, S; Fontaine, R; Alibart, F; Beilliard, Y; Drouin, D. (2023). A Fully Parallel, Bidirectional, and High-Speed FPGA-controlled System for In-Memory Computing Architectures and Neuromorphic Circuits. IEEE Transactions on Circuits and Systems I: Regular Papers (Submitted).
  • Mouny, P A; Dawant, R*; Galaup, B; Ecoffey S; Pioro-Ladriere, M; Beillard, Y; Drouin, D. (2023). Analog programming ofCMOS-compatible Al2O3/TiO2-x memristor at 4.2 K after metal-insulatortransition suppression by cryogenic reforming. Applied Physics Letters 123 (6), (Published).
  • El Mesoudy, A*; Machon, D; Ruediger, A; Jaouad, A; Alibart, F; Ecoffey, S; Drouin, D. (2023). Band gap narrowing induced by oxygen vacancies in reactively sputtered TiO2 thin films. Thin Solid Films 769 139737. (Published).
  • De Lafontaine, M; Bidaud, T; Gay, G; Pargon, E; Petit-Etienne, C; Turala, A; Stricher, R*; Ecoffey, S; Volatier, M; Jaouad, A; Valdivia, C E; Hinzer, K; Fafard, S; Aimez, V; Darnon, M. (2023). Dense 3D Interconnects for III-V Semiconductor Heterostructures in Miniaturized and HighPower Density Applications. Cell Reports Physical Science 4 (10170), (Published).
  • Mouny, P A; Beillard, Y; Graveline, S; Roux, M A; El Mesoudy, A*; Dawant, R*; Gliech, P*; Ecoffey, S; Alibart, F; Pioro-Ladriere, M; Drouin, D. (2023). Memristor-based cryogenic programmable DC sources for scalable in-situ quantum-dot control. IEEE Transactions on Electron Devices 70 (4), 1989 - 1995. (Published).
  • Liu T, Amirsoleimani A, Alibart F, Ecoffey S, Drouin D, Genov R. (2022). CODEX: Stochastic Encoding Method to Relax Resistive Crossbar Accelerator Design Requirements. IEEE Transactions on Circuits and Systems II: Express Briefs 69 (8), 3356-3360. (Published).
  • Najah M*, Ecoffey S, Singh T, Ferguson M*, Roby L.-P.*, Renaud J, Gondcharton P, Banville F. A.,Boucherit M*, Charlebois S, Frechette L, Mansour R, Boone F. (2022). Characterization of a wafer-level packaged Au-Ru/AlCu contact for micro-switches. IEEE Journal of Microelectromechanical Systems 31 (4), 700-711. (Published).
  • Ferguson M*, Najah M*, Banville F. A.*, Boucherit M*, Gond-Charton P, Renaud J, Frechette L, Boone F, Ecoffey S, Charlebois S. A. (2022). Exploring Ru Compatibility With Al-Ge Eutectic Wafer Bonding. IEEE Journal of Microelectromechanical Systems 31 (4), 599-603. (Published).
  • El Mesoudy, A*; Lamri, G*; Dawant, R*; Arias-Zapata, J; Gliech, P*; Beilliard, Y; Ecoffey, S; Ruediger, A; Alibart, F; Drouin, D. (2022). Fully CMOS-compatible passive TiO2-based memristor crossbars for in-memory computing. Microelectronic Engineering 255 111706. (Published).
  • Dawant R* , Seils R, Ecoffey S, Schmid R, Drouin D. (2022). Hybrid crosscorrelation and line-scan alignment strategy for CMOS chips electron-beamlithography processing. Journal of Vacuum Science and Technology B B (40), 012601. (Published).
  • Ferguson M*, Najah M*, Banville F. A.*, Boucherit M*, Miriyala N*, Renaud J, Frechette L, Boone F, Ecoffey S, Charlebois S. A. (2022). Mitigating reentrant etch profile undercut in Au etch with an aqua regia variant. Journal of The Electrochemical Society 169 (8), 083504. (Published).
  • Dawant, R*; Ecoffey, S; Drouin D. (2022). Multiple materialstack grayscale patterning using electron-beam lithography and a single plasmaetching step. Journal of Vaacum Science and Technology B B 40 (062603), (Published).
  • Najah M*, Maaboudallah F, Boucherit M*, Ferguson M*, Frechette L, Charlebois S, Boone F, Ecoffey S. (2022). Spectral analysis of the topography parameters for isotropic Gaussian rough surfaces applied to goldcoating. Tribology International 165 107339. (Published).
  • Stricher R*, Gond-Charton P, Amnache A, Ambia Campos J F, Frechette L, Drouin D, Ecoffey S. (2021). In-Situ Doped Polysilicon (ISDP) hydrophilic direct wafer bonding for MEMS applications. ECS Journal of Solid State Science and Technology 10 064010. (Published).
  • Blonkowski S, Labalette M*, Jeannot S, Ecoffey S, Souifi A, Drouin D. (2021). Modeling Current and Voltage peaks generation in Complementary Resistive Switching devices. Solid State Electronics 183 108122. (Published).
  • Liu T, Amirsoleimani A, Alibart F, Ecoffey S, Drouin D, Genov R. (2020). AIDX: AdaptiveInference Scheme to Mitigate State-Drift in Memristive VMM Accelerators. IEEE Transactions on Circuits and Systems II: Express Briefs 68 (4), (Published).
  • Mehrej M*, Ecoffey S, Sadani B, Lee Sang B*, Baron T, David S, Drouin D, Salem B. (2020). A fabrication process for self-connected horizontal SiGe nanowires. Microelectronic Engineering 220 111150. (Published).
  • Beillard Y, Paquette F, Brousseau F*, Ecoffey S, Alibart F, Drouin D. (2020). Investigation of resistive switching and transport mechanisms of Al2O3/TiO2−x memristors under cryogenic conditions (1.5 K). AIP Advances 10 (2), 025305. (Published).
  • Amirsoleimani A, Alibart F, Yon V, Xu J, Pazhouandeh M R, Ecoffey S, Beilliard Y, Genov R, Drouin D. (2020). In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspective. Advanced Intelligent Systems 2000115 1-23. (Published).
  • Ayele G T*, Monfray S, Ecoffey S, Boeuf F, Cloarec J P, Drouin D, Souifi A. (2018). Ultrahigh-Sensitive CMOS pH Sensor Developed in the BEOL of Standard 28 nm UTBB FDSOI. IEEE Journal of the Electron Devices Society 6 1026-1032. (Published).
  • Labalette M*, Jeannot S, Blonkowski S, Beilliard Y, Ecoffey S, Souifi A, Drouin D. (2017). Fabrication of planarback end of line compatible HfOx Complementary Resistive Switches. IEEE Transactions on Nanotechnology 16 (5), 745 - 751. (Published).
  • Rahhal L, Ayele G T*, Monfray S, Cloarec J-P, Fornacciari B, Padroux E, Du F, Chevalier C, Ecoffey S, Drouin D, Morin P, Garnier P, Boeuf F, Souifi A. (2017). High Sensitivity pH Sensing in BEOL of industrial FDSOI Transistors. Solid-State Electronics 134 22-29. (Published).
  • Bonafos C, Benassayag G, Cours R, Pecassou B, Guenery P V, Baboux N, Militaru L, Souifi A, Cossec E*, Hamga K*, Ecoffey S, Drouin D. (2017). Ion beam synthesis of indium-oxide nanocrystals for improvementof Oxide Resistive Random-Access Memories. Materials Research Express 5 (015027), (Published).
  • Droulers G*, Ecoffey S, Pioro-Ladriere, Drouin D. (2017). Metallic Single Electron Transistors: Impact of Parasitic Capacitances on Small Circuits. IEEE Transactions on Electron Devices 64 (12), 5202 - 5208. (Published).
  • Tesega Ayele G*, Rahhal L, Monfray S, Boeuf F, Cloarec J.-P., Ecoffey S, Drouin D, Souifi A. (2017). TCAD Simulation of anIon Sensitive Field Effect Transistor with a Sensitive Gate Integrated in the Back-End-of-Lineof a Fully-Depleted Silicon-on-Insulator Industrial Platform. IEEEE Transactions on Electron Devices (Revision Requested).
  • Drouin D, Droulers G*, Labalette M*, Lee Sang B*, Harvey-Collard P*, Souifi A, Jeannot S, Monfray S, Pioro-Ladriere M, Ecoffey S. (2016). A fabrication process for emerging nanoelectronic devices based on oxide tunnel junctions. Journal of Nanomaterials 2017 (8613571), 1-8. (Published).
  • Lee Sang B*, Sadani B, Ecoffey S, Monfray S, Drouin D. (2016). CMOS compatible fabrication process ofTiN/Al2O3/TiN tunnel junctions for BEOL integration of single electron transistors. Microelectronic Engineering (Submitted).
  • Mehrej M*, Drouin D, Baron T, Salem B, Ecoffey S. (2016). Fabrication of top-down gold nanostructures using a damascene process. Microelectronic Engineering 177 (2017), 41-45. (Published).
  • Ayadi Y*, Rahhal L, Vilquin B, Chevalier C, Ambris Vargas F, Ecoffey S, Ruediger A, Sarkissian A, Monfray S, Cloarec J-P, Souifi A, Drouin D. (2016). Novel concept of gas sensitivity characterization of materials suited for implementation in FET-based gas sensors. Nanoscale Research Letters 11 (481), 1-7. (Published).
  • Droulers G*, Ecoffey S, Pioro-Ladriere M, Drouin D. (2016). Planar Tunnel Junctions: A Time Stability Study. Journal of Vacuum Science and Technology B 34 (6), 0622203. (Published).
  • Lee Sang B*, Gour M-J, Jaouad A, Ecoffey S, Darnon M, Sadani B, Souifi A, Drouin D. (2015). Inductively coupled plasma etching of ultra-shallow Si3N4 nanostructures using SF6/C4F8chemistry. Microelectronic Engineering 141 (Published).
  • Lee Sang B*, Gour M-J, Darnon M, Ecoffey S, Jaouad A, Sadani B, Drouin D. (2015). Selective dry etching of TiN nanostructures over SiO2 nanotrenches using a Cl2/Ar/N2 inductivelycoupled plasma. Journal of Vacuum Science and Technology B 34 (2), (Published).
  • El Hajjam K*, Bounouar M A, Baboux N, Ecoffey S, Guilmain M*, Puyoo E, Francis L A, Souifi A, Drouin D, Calmon F. (2015). Tunnel Junction Engineering for Optimized Metallic Single-Electron Transistor. IEEE Transactions on Electron Devices 62 (9), (Published).
  • El Hajjam K*, Baboux N, Calmon F, Ecoffey S, Poncelet O, Francis L, Souifi A, Drouin D. (2014). Highly transparent low capacitance plasma enhanced atomic layer deposition Al2O3-HfO2 tunneljunction engineering. Journal of Vacuum Science and Technology A 32 (Published).
  • Guilmain M*, Labbaye T , Dellenbach F*, Nauenheim C , Drouin D , Ecoffey S. (2013). A damascene platform for controlled ultra-thin nanowire fabrication. Nanotechnology 24 (24), (Published).
  • Jouvet N*, Bounouar M A, Ecoffey S, Nauenheim C, Beaumont A, Monfray S, Ruediger A, Calmon F, Souifi A, Drouin D. (2012). Recent developments on 3D intregation of metallic SET onto CMOS process for memory application. International Journal of Nanoscience 11 (4), (Published).
  • Guilmain M*, Jaouad A, Ecoffey S, Drouin D. (2011). SiO2 shallow nanostructures ICP etching using ZEP electroresist. Microelectronic Engineering 88 (Published).
  • Ecoffey S, Guilmain M*, Morissette J F, Bourque F*, Pont J*, Lee Sang B*, Drouin D. (2011). Technology platform for the fabrication of titanium nanostructures. Journal of Vacuum Science and Technology B 29 (6), (Published).
  • Ecoffey S, Pott V, Mahapatra S, Bouvet D, Fazan P, Ionescu A M. (2005). A hybrid CMOS–SET co-fabrication platform using nano-grain polysilicon wires. Microelectronic Engineering 78 - 79 (Published).
  • Santinacci L, Djenizan T, Hildebrand H, Ecoffey S, Mokdad H, Campanella T, Schmuki P. (2003). Selective palladium electrochemical deposition onto AFM-scratched silicon surfaces. Electrochimica Acta 48 (Published).
  • Ecoffey S, Bouvet D, Ionescu A M, Fazan P. (2002). Low-pressure chemical vapour deposition of nanograin polysilicon ultra-thin films. Nanotechnology 13 (Published).

Chapitres de livre

  • Amirsoleimani A, Liu T, Alibart F, Ecoffey S, Chang Y.-F., Drouin D, Genov R. (2021). Mitigating State-Drift in Memristor Crossbar Arrays for Vector Matrix Multiplication. Yao-Feng Chang. Memristor - An Emerging Device for Post-Moore’s Computing and Applications (78752). IntechOpen. (Published).

Articles de conférence

  • Pandiya, S*; Sansregret, C; De Sousa, I; Ecoffey, S; Beilliard, Y; Drouin, D. (2024). Additive manufacturing of high-density (2.5 µm L/S) Ag-Cu stacked interconnects onorganic substrates. IEEE 74th Electronic Components and Technology Conference, ECTC. (Accepted).
  • Pares, V*; Amnache, A*; Stricher, R*; Landry, S; Gond-Charton, P*; Courcier, T; Ecoffey, S; Frechette, L G. (2024). Conductive direct bonding of in-situ doped polysilicon for MEMSwafer-level packaging. Hilton Head Workshop 2024: A Solid-State Sensors, Actuators and Microsystems Workshop. (Accepted).
  • Islam, M I*; Amnache, A; Beaudry, R; Delafosse, M; Ecoffey, S; Frechette, L G. (2024). Demonstration of Fabry-Perot interferometry for photolithography masks. Hilton Head Workshop 2024: A Solid-State Sensors, Actuators and Microsystems Workshop. (Accepted).
  • Pandiya, S*; Voisard, F; De Sousa, I; Ecoffey, S; Beillard, Y; Drouin, D. (2024). Effect of intense pulsed light curing on 3D printed Ag nanoparticleinterconnects for microelectronics. Microscopy Society of Canada, MSC 2024 meeting. (Accepted).
  • Pares, V*; Amnache, A; Landry, S; Belarbi, K; Frechette, L G; Ecoffey, S. (2024). In Situ Doped Polysilicon films CMP for MEMS applications. 25th International Symposium on CMP. (Submitted).
  • Gherman, R*; Beaudin, G; Levesque, P; Maclean, S; Ecoffey, S; Charette, P G. (2024). Reaching strong light-matter coupling regime with plasmonic nano-cube over mirror array and TMDmonolayer. Photonics West. (Accepted).
  • Kouame, K; Rehman, A; Marcotte, M; Ney, M; Turala, A; Najah, M; Ecoffey, S; Hamon, G. (2024). Thermal Modeling of Triple-Junction Solar Cells Fan Out Wafer Level Packaging for Concentrated Photovoltaic. 41st European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC. (Accepted).
  • Currie, A; Schwarz, S; German, R*; Charette, P G; Ecoffey, S; Levesque, P; MacLean, S. (2024). Ultrafast near-field photoemission of engineered nanocubes over mirrored array. The 13th International Conference on LEEM PEEM. (Accepted).
  • Hamieh H*, Borges J*, Paradis E, Beilliard Y, Ecoffey S, De Sousa I, Laliberte M, Douin D. (2023). 1.65 μm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications. 2023 IEEE 73rd Electronic Components and Technology Conference. (Published).
  • Pandiya S*, Sansregret C, De Sousa I, Ecoffey S, Beilliard Y, Drouin D. (2023). Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 μm L/S) on organic substrates for high-performance computing applications. 2023 IEEE 73rd Electronic Components and Technology Conference. (Published).
  • Dawant, R*; Gaudreau, M*; Roy, M A*; Arias-Zapata, J; Drouin, D; Ecoffey, S. (2023). Damascene Versus Etch-Back Chemical Mechanical Planarization forResistive Memory Crossbars Back-End-Of-Line Integration. 49th International Conference on Micro and Nano Engineering, MNE 2023. (Published).
  • Borges J*, Darnon M, Beilliard Y, Ecoffey S, De Sousa I, Douin D. (2023). Development of a plasma etching process of copper for the microfabrication of high-density interconnects in advanced packaging. IEEE 73rd Electronic Components and Technology Conference. (Published).
  • Gliech, P*; Arias-Zapata, J; Jaouad, A; Ecoffey, S; Drouin, D. (2023). Optimization of PECVD SiOx passivation layer for TiOx memristorsintegration. 20th Canadian Semiconductor Science and Technology Conference, CSSTC 2023. (Accepted).
  • Gherman, R*; Beaudin, G; Levesque, P; Maclean, S; Ecoffey, S; Charette, P G. (2023). Reaching stronglight-matter coupling regime with plasmonic nano-cube over mirror array andexciton in TMD monolayer. Photonics North. (Accepted).
  • Dawant, R*; Roy, M A*; Arias-Zapata, J; Drouin, D; Ecoffey, S. (2023). Reverse dual-damascene Chemical Mechanical Planarization for ResistiveMemory Crossbars Integration. 20th Canadian Semiconductor Science and Technology Conference, CSSTC 2023. (Accepted).
  • Garg, N; Balafrej, I; Muhr, E; Florini, D*; Querlioz, D; Bocquet, M; Ecoffey, S; Rouat, J; Beilliard, Y; Portal, J M; Alibart, F; Drouin, D. (2023). Synergizing In-Memory Learning and Bio-inspired ASICs: Advancing theFuture of Neuromorphic Computing. 20th Canadian Semiconductor Science and Technology Conference, CSSTC 2023. (Accepted).
  • Dawant R*, Ecoffey S, Drouin D. (2022). 3D shaping of multi-layers stack using a single plasma etching step and greyscaleelectron-beam lithography. The 65th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication – EIPBN. (Accepted).
  • De Lafontaine M, Gay G, Pargon E, Petit-Etienne C, Stricher R*, Ecoffey S, Turala A, Volatier M, Jaouad A, Fafard S, Aimez V, Darnon M. (2022). Micro-Scale III-V/GeMultijunction Solar Cell with Through Cell Via Contacts. 49th IEEE Photovoltaic Specialists Conference. (Accepted).
  • Dawant R*, Ecoffey S, Seils R, Schmid R, Drouin D. (2021). Comparison of alignment markers and method for electron-beam lithography on CMOS dies. The 64th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication - EIPBN. (Accepted).
  • De Lafontaine M, Gay G, Pargon E, Petit-Etienne C, Stricher R*, Ecoffey S, Volatier M, Jaouad A, Fafard S, Aimez V, Darnon M. (2021). III-V/GeMultijunction Solar Cell with Through Cell Via Contact Fabrication andCharacterization. 48th IEEE Photovoltaic Specialists Conference, PVSC 48. (Accepted).
  • Blonkowski S, Labalette M*, Jeannot S, Ecoffey S, Souifi A, Drouin D. (2021). Modeling Current and Voltage peaks generation in Complementary Resistive Switching devices. INFOS2021 22th Conference on Insulating Films on Semiconductors. (Accepted).
  • Najah M*, Ferguson M*, Boucherit M*, Guilmain M, Renaud J, Fréchette L, Charlebois S, Boone F, Ecoffey S. (2021). Ru plasma etching process for thermally stable and low resistivity contacts. 47th International Conference on Micro and Nano Engineering, MNE 2021. (Accepted).
  • Stricher R*, Gond-Charton P, Poirier J-S, Drouin D, Ecoffey S. (2020). Polysilicon CMP fordirect bonding and MEMS wafer level packaging. International Conference on Planarization Technology ICPT 2020. (Submitted).
  • Souifi A, Ayele G T*, Cloarec J P, Boeuf F, Ecoffey S, Drouin D, Monfray S. (2020). Sensing performances of integrated ISFETs on 28 nm CMOS FDSOI technology. IEEE Sensors France International Workshop 2020. (Accepted).
  • Bioud Y A, Beattie M N, Boucherif A, Jellit M, Stricher R*, Ecoffey S, Patriarche G, Troadec D, Soltani A, Braidy N, Wilkins M, Valdivia C E, Hinzer K, Drouin D, Ares R. (2019). A Porous Ge/Si Interface Layer for Defect-free III-V Multi-Junction Solar Cells on Silicon. Proceedings of SPIE: Physics, Simulation, and Photonic Engineering of Photovoltaic Devices VIII, (Published).
  • Calvo M, Beaudin G, Mercier-Coderre L, Girault P, Rojo Romeo P, Stricher R*, Ecoffey S, Drouin D, Bœuf F, Canva M, Monfray S, Orobtchouk R, Charette P G. (2019). Improving Silicon Nitride Ring Resonator Performances On 300 mm Industrial Environment For Pointof Care Applications. SPIE Photonics Europe. (Accepted).
  • Beilliard Y, Paquette F, Brousseau F*, Ecoffey S, Alibart F, Drouin D. (2019). Observation of Highly Nonlinear Resistive Switching of Al2O3/TiO2-based Memristors at Cryogenic Temperature (1.5 K). IEEE Nanotechnology Materials and Devices Conferences NMDC 2019. (Accepted).
  • Elshaer A*, Stricher R*, Darnon M, Drouin D, Ecoffey S. (2019). Patterning Platinum using CMP and plasma etching industrially compatible processes. 45th International Conference on Micro and Nano Engineering MNE 2019. (Accepted).
  • Stricher R*, Elshaer A*, Drouin D, Ecoffey S. (2019). Pt and Au planarization for the fabrication of micro- and nano- structures. 23rd International Symposium on Chemical-Mechanical Planarization. (Accepted).
  • Ayele G T*, Monfray S, Ecoffey S, Boeuf F, Cloarec J P, Drouin D, Souifi A. (2018). Highly Performant Integrated pH-Sensor Using the Gate Protection Diode in the BEOL of Industrial FDSOI. IEDM 2018 - International Electron Devices Meeting. (Accepted).
  • Maalaoui A, Frenea-Robin M, Genest J, Ecoffey S, Beauvais J, Charette P, Drouin D, Cloarec J P. (2018). Towards miniaturized pH sensor based on carbon nanotubes assembled by DEP on titanium electrodes?. 2018 IEEE International Conference on Industrial Technology (ICIT). (Published).
  • Ayele G T*, Monfray S, Ecoffey S, Boeuf F, Bon R, Cloarec J P, Drouin D, Souifi A. (2018). Ultrahigh-Sensitive and CMOS Compatible ISFET Developed in BEOL of Industrial UTBB FDSOI. Symposia on VLSI Technology. (Accepted).
  • Ayele G T*, Souifi A, Cloarec J P, Monfray S, Boeuf F, Ecoffey S, Drouin D. (2018). Ultrasensitive CMOS Electro-chemical Sensor Based on Fully Depleted SOI MOSFET. IEEE NANO 2018 International Conference on Nanotechnology. (Published).
  • Ben Assayag G, Bonafos C, Pecassou B, Drouin D, Ecoffey S, Souifi A, Torregrosa F. (2017). Innovative OxRAMnanomemories with indium oxide nanocrystals fabricated by ultra low energy ionimplantation. European Materials Research Society Spring Meeting, E-MRS 2017. (Published).
  • Ecoffey S, Drouin D. (2017). Nanoscale damasceneprocesses for patterning and devices fabrication. SPIE Advanced Lithography. (Published).
  • Merhej M*, Honegger T, Ecoffey S, Bassani F, Baron T, Peyrade D, Drouin D, Salem B. (2017). Toward 3D integrationof self-assembled horizontal Si and SiGe nanowires on CMOS chip. European Materials Research Society Fall Meeting, E-MRS 2017. (Accepted).
  • Ayele G T*, Monfray S, Boeuf F, Cloarec J-P, Ecoffey S, Drouin D, Puyoo E, Souifi A. (2017). Ultrasensitive Extended-Gate Ion-Sensitive-Field-Effect-Transistor Developed Utilizing anIndustrial UTBB FDSOI Platform. European Solid-State Device Research Conference, ESSDERC 2017. (Accepted).
  • Merhej M*, Drouin D, Salem B, Ecoffey S. (2016). A damascene process for gold micro- and nano- structures. 42nd International Conference on Micro and Nano Engineering, MNE 2016. (Published).
  • Droulers G*, Ecoffey S, Pioro-Ladriere M, Drouin D. (2016). A manufacturable process for single electron charge detection, a step towards quantum computing. IEEE Xplore, (Published).
  • Lee Sang B*, Ecoffey S, Monfray S, Drouin D. (2016). CMOS BEOL compatible process for the fabrication of single electron transistors, using TiN/Al2O3/TiNjunctions. 42nd International Conference on Micro and Nano Engineering, MNE 2016. (Published).
  • Labalette M*, Ecoffey S, Jeannot S, Soufi A, Drouin D. (2016). HfOx complementary resistive switches. IEEE Nanotechnology Materials and Devices Conferences NMDC 2016. (Published).
  • Souifi A, Cossec E*, Hamga K*, Guenery P-V, Troudi M, El Hajjam K*, Benea L, Baboux N, Militaru L, Hebras X, Bonafos C, Ben Assayag G, Pecassou B, Ecoffey S, Drouin D. (2016). Integration and Electrical Characterization of Indium-Oxide Nanoparticles in Oxide ResistiveRandom-Access Memories. CMOS Emerging Technologies, CMOSET 2016. (Published).
  • Labalette M*, Ecoffey S, Blonkowski S, Jeannot S, Souifi A, Drouin D. (2016). Planar HfOx basedReRAM using nanodamascene process. NANO 2016, 13th International Conference on Nanostructured Materia. (Published).
  • Ben Assayag G, Carles C, Bonafos C, Pecassou B, Hebras X, Schamm-Chardon S, Drouin D, Ecoffey S, Souifi A. (2016). Ultra Low Energy Ion Beam Synthesis: An Original Method for the Fabrication of Nanocrystals inDielectrics for Nanoelectronics, Nano-Optics and Plasmonic Applications. CMOS Emerging Technologies, CMOSET 2016. (Published).
  • Ayadi A*, Lee Sang B*, Sadani B, El Hajjam K*, Ecoffey S, Calmon F, Souifi A, Drouin D. (2015). 3D integration of double gate single electron transistors in the CMOS Back-End-Of-Line for ultra-low power gas sensing. 17th Canadian Semiconductor Science and Technology Conference, CSSTC 2015. (Published).
  • Drouin D, Bounouar M A, Droulers G*, Labalette M*, Pioro-Ladriere M, Souifi A, Ecoffey S. (2015). 3D microelectronic with BEOL compatible devices. IEEE Xplore, (Published).
  • Labalette M*, Ecoffey S, Drouin D. (2015). Fabrication of nanoplanar resistive RAM devices using the nanodamascene process. 17th Canadian Semiconductor Science and Technology Conference, CSSTC 2015. (Published).
  • Ayadi Y*, Rahhal L, Vilquin B, Chevalier C, Ambris Vargas F, Ecoffey S, Ruediger A, Sarkissian A, Monfray S, Cloarec J-P, Drouin D, Souifi A. (2015). Novel concept of gas sensitivity characterization of materials suited for implementation in FET-based gas sensors. 6th International Conference on Micro-Nanoelectronics, Nanotechnologies & MEMs, Micro&Nano. (Published).
  • Droulers G*, Ecoffey S, Pioro-Ladriere M, Drouin D. (2015). Planar Tunnel Junctions: A Time Stability Study. 17th Canadian Semiconductor Science and Technology Conference, CSSTC 2015. (Published).
  • Ionescu M, Ayadi Y*, Cote C, Ecoffey S, Nouar R, Wolfe S, Drouin D, Porter R, Sarkissian A. (2015). Plasma and Vacuum Assisted Synthesis of Nanostructured Carbon Allotropes and Applications to Gas Sensors. Graphene Canada. (Published).
  • Droulers G*, Ecoffey S, Pioro-Ladriere M, Drouin D. (2015). Quantum Cellular Automata: Design and Fabrication with the Nanodamascene Process. 41st International Conference on Micro and Nano Engineering, MNE 2015. (Published).
  • Drouin D, Droulers G*, Labalette M*, Lee Sang B*, Harvey-Collard P, Pioro-Ladriere M, Ecoffey S. (2015). The nanodamascene process: a versatile fabrication technique. IEEE Xplore, (Published).
  • Droulers G*, Ecoffey S, Guilmain M*, Souifi A, Pioro-Ladriere M, Drouin D. (2014). Damascene Planar Metal-Insulator-Metal Tunnel Junctions. IEEExplore, (Published).
  • Lee Sang B*, Jaouad A, Ecoffey S, Darnon M, Gour M-J, Sadani B, Souifi A, Drouin D. (2014). Inductively Coupled Plasma Etching of Ultra-Shallow Si3N4 and SiO2 Nanostructures. 40th International Conference on Micro and Nano Engineering, MNE 2014. (Published).
  • Drouin D, Ecoffey S, El Hajjam K*, Lee Sang B*, Sadani B, Harvey-Collard P, Valverde L*, Labalette M*, Calmon F, Souifi A. (2014). Integration of nanoelectronic devices within BEOL of CMOS circuit. European Materials Research Society Fall Meeting, E-MRS 2014. (Published).
  • Lee Sang B*, Gour M-J, Darnon M, Ecoffey S, Jaouad A, Sadani B, Souifi A, Drouin D. (2014). Selective Dry Etching of Titanium Nitride Nanostructures with Chlorine-Based Inductively Coupled Plasma. 40th International Conference on Micro and Nano Engineering, MNE 2014. (Published).
  • El Hajjam K*, Baboux N, Ecoffey S, Francis L, Souifi A, Calmon F, Drouin D. (2013). Crested Barrier Tunnel Junctions Using PEALD Al2O3/HfO2 Stackings. 13th International Conference on Atomic Layer Deposition ALD 2013. (Published).
  • Ecoffey S, Guilmain M*, Nauenheim C, Drouin D. (2013). Nanometer scale titanium structures planarization. 18th International Symposium on Chemical-Mechanical Planarization. (Published).
  • Souifi A, Jouvet N, Ecoffey S, Guilmain M*, Naueunheim C, Ruediger A, Beaumont A, Calmon F, Monfray S, Drouin D. (2012). 3D integration of low power nanoelectronic devices above CMOS circuits. Nanoscale Science & Technology, NANOST12. (Published).
  • Ecoffey S, Guilmain M*, Droulers G*, Landry S*, Nauenheim C, Ruediger A, Drouin D. (2012). Chemical mechanical planarization of titanium micro and nano-structures. 38th International Conference on Micro and Nano Engineerin MNE 2012. (Published).
  • Griveau D, Ecoffey S, Parekh R M, Bounouar M A, Calmon F, Beauvais J, Drouin D. (2012). Single Electron CMOS-Like One Bit Full Adder. IEEE Xplore, (Published).
  • Bounouar M A, Calmon F, Beaumont A, Guilmain M*, Xuan W, Ecoffey S, Drouin D. (2011). Single Electron Transistor Analytical Model for Hybrid Circuit Design. IEEE Xplore, (Published).
  • Ecoffey S, Morissette J F, Guilmain M*, Bourque F*, Pont J, Lee Sang B, Drouin D. (2011). Top-down approaches for the fabrication of titanium nanostructures. 55th International Conference on Electron, Ion, and Photon Beam Technology, and Nanofabrication EIPBN 2011. (Published).
  • Ecoffey S, Morissette J F, Jedidi N, Guilmain M*, Nauenheim C, Drouin D. (2011). Ultrathin Titanium Passive Devices Fabrication. IEEE Xplore, (Published).
  • Guilmain M*, Jaouad A, Ecoffey S, Drouin D. (2010). Nanoscale SiO2 ICP etching. 36th International Conference on Micro- and Nano-Engineering MNE 2010. (Published).

Autres contributions

Gestion d'évènements

  • Reviewer and co-chair Advanced Logic Technology sub-committee. (2019) IEDM - International Electron Devices Meeting. (Conference).
  • Reviewer and co-chair, Process Manufacturing and Technology sub-committee. (2019) IEDM - International Electron Devices Meeting. (Conference).

Activités de collaboration internationale

  • Researcher. Canada. I am a member of the Laboratoire Nanotechnologies Nanosystèmes (LN2) CNRS-IRL 3463. I am co-leader of the Packaging research axis which regroups 7 Professors and 25 HQPs. The LN2 is a bilateral joint research unit between France and Canada in the field of nanotechnologies and nanosystems.
  • Researcher. France. Since its creation in 2012, I am a member of the ST Microelectronics (STM) / Laboratoire des Nanotechnologies et Nanosystèmes (LN2) joint laboratory.
  • Laurent Bechou (IMS Bordeaux). France. Prof. Bechou was a member of the advisory committee of the PhD student Najah M*. His expertise in MEMS, packaging and reliability of circuit and systems was essential to our RF-MEMS project.
  • Marco Mazza (HEIFR Fribourg). Switzerland. Marco Mazza is a Professor at University of Applied Science - Western Switzerland in Fribourg. He works on working on ASIC-based capacitive-coupled RFID tags, printed sensors, electro-physiology sensors and implantable systems. We co-supervised Jeanneret M* for his Master thesis in modelling, simulation and fabrication of memristive devices and small circuits.

Présentations

  • Ecoffey S, Renaudin A. (2022). Université de Sherbooke & C2MI Integrated Innovation Chain as a workforce generator. CMC LAB2FAB Workshop 2022. Whistler, Canada